M. N. Premachandran : rechercher sur Z-Library

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1

Discussion of “ Moments in Deck Slabs Due to Cantilever Loads ” by Aftab A. Mufti, Baidar Bakht, and Leslie G. Jaeger (June, 1993, Vol. 119, No. 6)

Premachandran, R., Tachibana, Y.

Journal:

Journal of Structural Engineering

Année:

1994

Langue:

english

Fichier:

PDF, 92 KB

english, 1994

2

Design and Development of Fine Pitch Copper/Low-K Wafer Level Package

Rao, V.S., Xiaowu Zhang, Ho Soon Wee, Rajoo, R., Premachandran, C.S., Kripesh, V., Seung Wook Yoon, Lau, J.H.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2010

Langue:

english

Fichier:

PDF, 2.09 MB

english, 2010

3

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Wafer level high temperature reliability study by backside probing f or a 50um thin TSV wafer

Premachandran, C.S, Ranjan, Rakesh, Agarwal, Rahul, Fui, Yap Sing, Paliwoda, Peter, Sarasvathi, Thangaraju, Arfa, Gondal, Patrick, Justison, Mahadeva Iyer, Natarajan

Année:

2015

Langue:

english

Fichier:

PDF, 1.50 MB

english, 2015

4

SPIE Proceedings [SPIE Microelectronic Manufacturing - Santa Clara, CA (Sunday 20 September 1998)] Multilevel Interconnect Technology II - Characterization of pattern density and the metal stack composition on chlorine residues from the metal etch process

Loong, Sang Y., Lee, Hian K., Zhou, Mei-Sheng, Chan, Lap H., Premachandran, Vayalakkara, Graef, Mart, Patel, Divyesh N.

Année:

1998

Langue:

english

Fichier:

PDF, 1.77 MB

english, 1998

5

A micromechanics-based constitutive model of polycrystalline ice and FEM analysis for prediction of ice forces

R. Premachandran, Hideyuki Horii

Journal:

Cold Regions Science and Technology

Année:

1994

Langue:

english

Fichier:

PDF, 1.31 MB

english, 1994

6

Numerical Simulation of the Jet Impingement Cooling of a Circular Cylinder

Singh, Dushyant, Premachandran, B., Kohli, Sangeeta

Journal:

Numerical Heat Transfer, Part A: Applications

Année:

2013

Langue:

english

Fichier:

PDF, 2.07 MB

english, 2013

7

Experimental and numerical investigation of jet impingement cooling of a circular cylinder

Singh, Dushyant, Premachandran, B., Kohli, Sangeeta

Journal:

International Journal of Heat and Mass Transfer

Année:

2013

Langue:

english

Fichier:

PDF, 2.80 MB

english, 2013

8

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Reliability Results of 0.8 mil Fine Pitch Copper wire bonding on Immersion Gold Plated Pad for Copper Low-k Devices

Wai, Leong Ching, Zhang, Xiaowu, Kripesh, V., Premachandran, C. S., Chong, S.C., Liu, Ying Ying, Madhukumar, J., Srinivas, Vempati Rao, Thaw, PP, Jong, MJ, Lau, John H., Wang, Sandy, Foo, CK, Thew, ML

Année:

2008

Langue:

english

Fichier:

PDF, 5.84 MB

english, 2008

9

Effect of nozzle shape on jet impingement heat transfer from a circular cylinder

Singh, Dushyant, Premachandran, B., Kohli, Sangeeta

Journal:

International Journal of Thermal Sciences

Année:

2015

Langue:

english

Fichier:

PDF, 9.46 MB

english, 2015

10

Circular air jet impingement cooling of a circular cylinder with flow confinement

Singh, Dushyant, Premachandran, B., Kohli, Sangeeta

Journal:

International Journal of Heat and Mass Transfer

Année:

2015

Langue:

english

Fichier:

PDF, 4.42 MB

english, 2015

11

Experimental and numerical studies on film cooling with reverse/backward coolant injection

Singh, Kuldeep, Premachandran, B., Ravi, M.R.

Journal:

International Journal of Thermal Sciences

Année:

2017

Langue:

english

Fichier:

PDF, 6.27 MB

english, 2017

12

[IEEE 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2016.7.18-2016.7.21)] 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A thermo mechanical finite element modeling approach to solving stress induced passivation failures

Mirza, Fahad, Khor, E E Jan, Lee, Fook Hong, Premachandran, C S, Yi, Wanbing, Tan, Juan Boon, Graas, Carole, Justison, Patrick

Année:

2016

Fichier:

PDF, 546 KB

2016

13

[IEEE 2017 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2017.4.2-2017.4.6)] 2017 IEEE International Reliability Physics Symposium (IRPS) - Impact of TSV process on 14nm FEOL and BEOL reliability

Kannan, Sukeshwar, Premachandran, C. S., Smith, Daniel, Ranjan, Rakesh, Cimino, Salvatore, Yeap, Kong Boon, Wu, George, Cao, Linjun, Prabhu, Manjunatha, Agarwal, Rahul, Yao, Walter, England, Luke, Jus

Année:

2017

Langue:

english

Fichier:

PDF, 771 KB

english, 2017

14

A coupled level set and volume of fluid method on unstructured grids for the direct numerical simulations of two-phase flows including phase change

Kumar Singh, Nikhil, Premachandran, B.

Journal:

International Journal of Heat and Mass Transfer

Année:

2018

Langue:

english

Fichier:

PDF, 5.73 MB

english, 2018

15

[ASME ASME Turbo Expo 2018: Turbomachinery Technical Conference and Exposition - Oslo, Norway (Monday 11 June 2018)] Volume 7B: Structures and Dynamics - A CFD Based Approach for Estimation of Rotor Dynamic Coefficients for Liquid Annular Seals in Turbomachinery

Krishna, Bachanti, Premachandran, B., Darpe, Ashish K.

Année:

2018

Langue:

english

Fichier:

PDF, 1.22 MB

english, 2018

16

Turbulent multi-jet impingement cooling of a heated circular cylinder

Pachpute, Sharad, Premachandran, B.

Journal:

International Journal of Thermal Sciences

Année:

2020

Langue:

english

Fichier:

PDF, 7.50 MB

english, 2020

17

Chlorine implantation into amorphous germanium

V. Premachandran, S. Guha, R.P. Sharma, M.B. Kurup

Journal:

Thin Solid Films

Année:

1982

Langue:

english

Fichier:

PDF, 242 KB

english, 1982

18

Conjugate mixed convection with surface radiation from a horizontal channel with protruding heat sources

B. Premachandran, C. Balaji

Journal:

International Journal of Heat and Mass Transfer

Année:

2006

Langue:

english

Fichier:

PDF, 851 KB

english, 2006

19

Stability of Pd/Nb2O5/amorphous hydrogenated silicon solar cells

V. Premachandran, S. Guha

Journal:

Année:

1983

Langue:

english

Fichier:

PDF, 299 KB

english, 1983

20

A standard reference material for the measurement of particle mobility by electrophoretic light scattering

Vincent A Hackley, Ramannair S Premachandran, Subhas G Malghan, Susannah B Schiller

Journal:

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Année:

1995

Langue:

english

Fichier:

PDF, 1.40 MB

english, 1995

21

Adhesion and friction properties of micro/nano-engineered superhydrophobic/hydrophobic surfaces

Y. Song, R. Premachandran Nair, M. Zou, Y.A. Wang

Journal:

Thin Solid Films

Année:

2010

Langue:

english

Fichier:

PDF, 539 KB

english, 2010

22

The use of the pin-on-disk tribology test method to study three unique industrial applications

Rahul Premachandran Nair, Drew Griffin, Nicholas X. Randall

Journal:

Année:

2009

Langue:

english

Fichier:

PDF, 1005 KB

english, 2009

23

Superhydrophobic surfaces produced by applying a self-assembled monolayer to silicon micro/nano-textured surfaces

Yong Song, Rahul Premachandran Nair, Min Zou, Yongqiang Wang

Journal:

Année:

2009

Langue:

english

Fichier:

PDF, 511 KB

english, 2009

24

Chromosomal Stability in the Backcross Progenies of Pentaploid Hybrids between Avena sativa L. and A. maroccana Gdgr.

S. N. Zadoo, R. N. Choubey, S. K. Gupta, M. N. Premachandran

Journal:

Année:

1988

Langue:

english

Fichier:

PDF, 2.65 MB

english, 1988

25

Measuring the effectiveness of bad pixel detection algorithms using the ROC curve

Premachandran, V., Kakarala, R.

Journal:

IEEE Transactions on Consumer Electronics

Année:

2010

Langue:

english

Fichier:

PDF, 445 KB

english, 2010

26

Development of a Cu/Low- Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

Xiaowu Zhang, Lau, J.H., Premachandran, C.S., Ser-Choong Chong, Leong Ching Wai, Lee, V., Chai, T.C., Kripesh, V., Sekhar, V.N., Pinjala, D., Che, F.X.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2011

Langue:

english

Fichier:

PDF, 1.92 MB

english, 2011

27

Fabrication and Testing of a Wafer-Level Vacuum Package for MEMS Device

Premachandran, C.S., Ser Choong Chong,, Liw, S., Nagarajan, R.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2009

Langue:

english

Fichier:

PDF, 783 KB

english, 2009

28

Design, Fabrication, and Assembly of an Optical Biosensor Probe Package for OCT (Optical Coherence Tomography) Application

Premachandran, C.S., Khairyanto, A., Sheng, K., Singh, J., Teo, J., Yingshun, X., Nanguang, C., Sheppard, C., Olivo, M.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2009

Langue:

english

Fichier:

PDF, 2.03 MB

english, 2009

29

Low-Stress Bond Pad Design for Low-Temperature Solder Interconnections on Through-Silicon Vias (TSVs)

Zhang, Xiaowu, Rajoo, Ranjan, Selvanayagam, Cheryl S., Premachandran, Chirayarikathuveedu Sankarapillai, Choi, Won Kyoung, Ho, Soon Wee, Ong, Siong Chiew, Xie, Ling, Pinjala, Damaruganath, Kwong, Dim-

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2011

Langue:

english

Fichier:

PDF, 1009 KB

english, 2011

30

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - A Vertical Wafer Level Packaging using Through Hole Filled Via Interconnects by Lift Off Polymer Method for MEMS and 3D Stacking Applications

Premachandran, C.S., Mohanraj, R.N.S., Chong Ser Choong,, Iyer, M.K.

Année:

2005

Langue:

english

Fichier:

PDF, 321 KB

english, 2005

31

Isolation and characterization of 22 mesophilic methanococci

Whitman, William B., Shieh, Jersong, Sohn, Seehyang, Caras, David S., Premachandran, Usha

Journal:

Systematic and Applied Microbiology

Année:

1986

Langue:

english

Fichier:

PDF, 931 KB

english, 1986

32

Perceptually motivated shape context which uses shape interiors

Premachandran, Vittal, Kakarala, Ramakrishna

Journal:

Pattern Recognition

Année:

2013

Langue:

english

Fichier:

PDF, 1.35 MB

english, 2013

33

A Numerical Study of Combined Forced Convection and Gas Radiation From a Circular Cylinder in Cross Flow

Pachpute, Sharad, Premachandran, B., Talukdar, Prabal

Journal:

Heat Transfer Engineering

Année:

2015

Langue:

english

Fichier:

PDF, 1.54 MB

english, 2015

34

A Coupled Level Set and Volume of Fluid method with multi-directional advection algorithms for two-phase flows with and without phase change

Ningegowda, B.M., Premachandran, B.

Journal:

International Journal of Heat and Mass Transfer

Année:

2014

Langue:

english

Fichier:

PDF, 3.89 MB

english, 2014

35

Development of a Disposable Bio-Microfluidic Package With Reagents Self-Contained Reservoirs and Micro-Valves for a DNA Lab-on-a-Chip (LOC) Application

Ling Xie,, Premachandran, C.S., Chew, M., Ser Choong Chong,

Journal:

IEEE Transactions on Advanced Packaging

Année:

2009

Langue:

english

Fichier:

PDF, 2.20 MB

english, 2009

36

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Influence of optical probe packaging on a 3D MEMS scanning micro-mirror for optical coherence tomography (OCT) applications

Premachandran, C.S., Khairyanto, Ahmad, Chen, Kelvin, Jank Singh,, Wang, Sandy X.L., Xu Yingshun,, Chen Nanguang,, Sheppard, C.J.R., Olivo, Malini, Lau, John

Année:

2008

Langue:

english

Fichier:

PDF, 739 KB

english, 2008

37

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - A novel, wafer-level stacking method for low-chip yield and non-uniform, chip-size wafers for MEMS and 3D SIP applications

Premachandran, C. S., Lau, John, Ling Xie,, Ahmad Khairyanto,, Chen, Kelvin, Myo Ei Pa Pa,, Chew, Michelle, Won Kyoung Choi,

Année:

2008

Langue:

english

Fichier:

PDF, 439 KB

english, 2008

38

Temperature dependence of the mobility edge in amorphous silicon

Premachandran, V., Narasimhan, K. L., Bapat, D. R.

Journal:

Physical Review B

Année:

1984

Langue:

english

Fichier:

PDF, 132 KB

english, 1984

39

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Development of negative profile of dry film resist for metal lift off process

Chew, Michelle, Ho, Soon Wee, Su, Nandar, Liao, Ebin, Rao, Vempati Srinivas, Premachandran, C S, Kumar, Rakesh, Damaruganath, Pinjala

Année:

2009

Langue:

english

Fichier:

PDF, 401 KB

english, 2009

40

[IEEE 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (21-25 July 1997)] Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Investigation for lateral diecrack on SIP power device

Premachandran, C.S., Palmeda, E.M., Chai, T.C.

Année:

1997

Langue:

english

Fichier:

PDF, 579 KB

english, 1997

41

The Dragonfly Flight Envelope and its Application to Micro UAV Research and Development

Chahl, Javaan, Dorrington, Graham, Premachandran, Sarah, Mizutani, Akiko

Journal:

IFAC Proceedings Volumes

Année:

2013

Langue:

english

Fichier:

PDF, 151 KB

english, 2013

42

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Wednesday 1 October 1997)] Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III - Analysis on the metal etch resist selectivity measurement

Premachandran, Vayalakkara, Joy, Raymond, Ho, Paul K. K., Lok, Lee W., Schuelke, Thomas, Tsai, Young, Ghanbari, Abe, Toprac, Anthony J.

Année:

1997

Langue:

english

Fichier:

PDF, 506 KB

english, 1997

43

Double circular air jet impingement cooling of a heated circular cylinder

Singh, Dushyant, Premachandran, B., Kohli, Sangeeta

Journal:

International Journal of Heat and Mass Transfer

Année:

2017

Langue:

english

Fichier:

PDF, 6.50 MB

english, 2017

44

Experimental and numerical investigations of slot jet impingement with and without a semi-circular bottom confinement

Pachpute, Sharad, Premachandran, B.

Journal:

International Journal of Heat and Mass Transfer

Année:

2017

Langue:

english

Fichier:

PDF, 6.55 MB

english, 2017

45

Two B-box proteins regulate photomorphogenesis by oppositely modulating HY5 through their diverse C-terminal domains

Job, Nikhil, Yadukrishnan, Premachandran, Bursch, Katharina, Datta, Sourav, Johansson, Henrik

Journal:

PLANT PHYSIOLOGY

Année:

2018

Langue:

english

Fichier:

PDF, 2.81 MB

english, 2018

46

Effect of the shape of flow confinement on turbulent slot jet impingement cooling of a heated circular cylinder

Pachpute, Sharad, Premachandran, B.

Journal:

International Journal of Thermal Sciences

Année:

2018

Langue:

english

Fichier:

PDF, 6.93 MB

english, 2018

47

[IEEE 2018 IEEE International Reliability Physics Symposium (IRPS) - Burlingame, CA (2018.3.11-2018.3.15)] 2018 IEEE International Reliability Physics Symposium (IRPS) - Reliability challenges for 2.5D/3D integration: An overview

Premachandran, C S, Choi, Seungman, Cimino, Salvatore, Tran-Quinn, Thuy, Burrell, Lloyd, Justison, Patrick

Année:

2018

Langue:

english

Fichier:

PDF, 781 KB

english, 2018

48

Effect of Thermal Barrier Coating and Gas Radiation on Film Cooling of a Corrugated Surface

Singh, Kuldeep, Premachandran, B., Ravi, M. R.

Journal:

Journal of Heat Transfer

Année:

2018

Langue:

english

Fichier:

PDF, 1.95 MB

english, 2018

49

Saturated film boiling of water over a finite size heater

Ningegowda, B.M., Premachandran, B.

Journal:

International Journal of Thermal Sciences

Année:

2019

Langue:

english

Fichier:

PDF, 8.57 MB

english, 2019

50

Effect of atmospheric wind on natural convection based solar air heaters

Kumar, Digpal, Premachandran, B.

Journal:

International Journal of Thermal Sciences

Année:

2019

Langue:

english

Fichier:

PDF, 3.62 MB

english, 2019